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Investigation of the interface between silicon nitride passivations and AlGaN/AlN/GaN heterostructures by C(V) characterization of metal-insulator-semiconductor-heterostructure capacitors

机译:通过金属-绝缘体-半导体-异质结构电容器的C(V)表征研究氮化硅钝化和AlGaN / AlN / GaN异质结构之间的界面

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摘要

Capacitance-voltage [C(V)] measurements of metal-insulator-semiconductor-heterostructure capacitors are used to investigate the interface between silicon nitride passivation and AlGaN/AlN/GaN heterostructure material. AlGaN/AlN/GaN samples having different silicon nitride passivating layers, deposited using three different deposition techniques, are evaluated. Different interface state distributions result in large differences in the C(V) characteristics. A method to extract fixed charge as well as traps from the C(V) characteristics is presented. Rough estimates of the emission time constants of the traps can be extracted by careful analysis of the C(V) characteristics. The fixed charge is positive for all samples, with a density varying between 1.3 x 10(12) and 7.1 x 10(12) cm(-2). For the traps, the peak density of interface states is varying between 16 x 10(12) and 31 x 10(12) cm(-2) eV(-1) for the three samples. It is concluded that, of the deposition methods investigated in this report, the low pressure chemical vapor deposited silicon nitride passivation shows the most promising results with regards to low densities of interface states.
机译:金属-绝缘体-半导体-异质结构电容器的电容电压[C(V)]测量用于研究氮化硅钝化与AlGaN / AlN / GaN异质结构材料之间的界面。对使用三种不同的沉积技术沉积的具有不同氮化硅钝化层的AlGaN / AlN / GaN样品进行了评估。不同的界面状态分布会导致C(V)特性的较大差异。提出了一种从C(V)特性中提取固定电荷和陷阱的方法。可以通过仔细分析C(V)特性来提取陷阱的发射时间常数的粗略估计。所有样品的固定电荷为正,密度在1.3 x 10(12)和7.1 x 10(12)cm(-2)之间变化。对于陷阱,三个样品的界面态峰密度在16 x 10(12)和31 x 10(12)cm(-2)eV(-1)之间变化。结论是,在本报告中研究的沉积方法中,低压化学气相沉积氮化硅钝化在界面态的低密度方面显示出最有希望的结果。

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